Hong Kong Experiential Learning Mobility Scholarship (722200302844)
TERMS OF REFERENCE FOR AN ANNUAL FUND
NAME OF ANNUAL FUND
Hong Kong Experiential Learning Mobility Scholarship
The Hong Kong Experiential Learning Initiative (HKELI) is a hit-the-ground-running, hands-on experience for students at the Telfer School of Management who want to explore the Asian business landscape through the lens of this cosmopolitan financial capital.
PURPOSE OF FUND
Award mobility scholarships to Telfer School of Management students participating in the Hong Kong Experiential Learning Initiative.
The applicant must:
be a Canadian citizen, a permanent resident, a person with the protected/refugee status or an international student;
be registered as a full-time student at the time of application to the BCom program at the Telfer School of Management of the University of Ottawa. Students in their final year are eligible to receive the scholarship after graduation;
be in good academic standing; and
4. intend to travel to participate in an internship as part of the Hong Kong Experiential Learning Initiative.
Value of the award: Minimum $1,000
Number of awards: Variable
Frequency of the award: Annual
Level or program of study: Undergraduate
Application contact: Financial Aid and Awards Service
Application deadline: Applications must be submitted no later than 4 pm on the final Tuesday of each month to be considered eligible to receive the scholarship in that month.
Applications must be made through Online Scholarships and Bursaries, which can be accessed through https://scholarships.uottawa.ca, and must include:
a proof of participating in an internship as part of the Hong Kong Experiential Learning Initiative (HKELI);
a resume and cover letter, specific to the job to which they are applying; and
Note : Students must be applying to a job on the HKELI webpage.